Comparative Study of the Scaling Effect on Pressure Profiles in Capillary Underfill Process

Abstract

Optimization of the capillary underfill (CUF) encapsulation process is vital to enhance the package’s reliability. Therefore, the design and sizing of the newly developed ball grid array (BGA) device must be considered so that it is compatible with the CUF process. The scaling effect of BGA on CUF flow and its dynamic properties is thoroughly investigated by means of fluid-structure interaction (FSI) numerical simulation. This paper generally highlighted the differences in CUF flow behaviours, together with the pressure distributions between the actual industrial size BGA and the scaled up models for large BGA setup. While flow front profiles appeared to be similar across BGA of various sizes at relative error less than 10%, the CUF filling time gradually increases as the BGA become larger. The scaling limit is found to be at 20, based on the analysis of dimensionless number. The entrant pressure however decreases when the BGA device being scaled up. These findings will assist in the future BGA designs for various sizes used in the CUF encapsulation process.