Abstract
A comparison of the performance of high resolution lithographic tools is presented here. The authors use extreme ultraviolet interference lithography, electron beam lithography, and He ion beam lithography tools on two different resists that are processed under the same conditions. The dose-to-clear and the lithographic contrast are determined experimentally and are used to compare the relative efficiency of each tool. The results are compared to previous studies and interpreted in the light of each tool-specific secondary electron yield. In addition, the patterning performance is studied by exposing dense lines/spaces patterns, and the relation between critical dimension and exposure dose is discussed. Finally, the lumped parameter model is employed in order to quantitatively estimate the critical dimension of lines/spaces, using each tool specific aerial image. Our implementation is then validated by fitting the model to the experimental data from interference lithography exposures and extracting the resist contrast.
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