Comparative study of as-annealed pure Al and Al–Te: An insight into texture-electrical/mechanical property correlations

Abstract

The effects of the microstructure on the electrical conductivity (EC) and tensile performance of as-annealed Al and Al–Te were comparatively investigated for the first time. The correlation between the texture evolution and EC was revealed using the latest research approach. The results show that the addition of Te (0.1wt%) enhanced the EC compared with that of the as-annealed pure Al and slightly decreased the tensile strength and static toughness. In the as-annealed pure Al, the texture transition rate XTrans showed positive correlations with the EC. Therein, the Cube {001} <100> texture played a decisive role in the EC, and the intensity of the Brass {001} <112> orientation played a leading role in the tensile strength. Te microalloying enhanced the deformation texture and retarded the recrystallization of the Al-Te alloy. Increasing the texture index FCGB was beneficial for improving the static toughness (S). The inverse function of dislocation density FKAM (=1/θ), which is inversely proportional to the dislocation density, exhibited a positive correlation with the EC. A high value of texture index XCB corresponded to a low dislocation density, and the quasi-spherical shell structure, composed of a Te layer and FeAl2, contributed to improving the EC.