Comparative Numerical Analysis of Double-Layer Microchannel Heat Sink with Sinusoidal Fins

Abstract

Effective cooling in confined microelectronic devices plays a vital role in increasing their performance and lifespan. Microchannel heatsink is proved to be one of the effective methods for cooling such compact devices. In the present work, a comparative numerical analysis has been done for three double-layer microchannel heat sink configurations. Rectangular and sinusoidal fins of equal length have been introduced in both the upper and lower channels of the double-layer microchannel. The overall thermal performance of the proposed configurations has been compared with the simple double-layered microchannel (without sinusoidal fin) heat sink. A laminar, incompressible, and steady-state numerical analysis has been done for different Re and heat fluxes values. Results show that double layer microchannel with sinusoidal fin has more potential to dissipate heat compared to its counterparts. However, it encounters more pressure drop nevertheless, sinusoidal finned channel exhibits higher total performance factor compared to simple double-layered microchannel.