Abstract
A comparative analysis of the thermoelectric behavior of Molybdenum Silicide and Bismuth Telluride using the COMSOL-Multiphysics platform is presented. Parameters like temperature distribution, potential distribution, figure of merit all the way through the length of the model and isothermal contours for these materials are reported. The outcomes of the modeling and simulation have revealed the potential use of Bismuth Telluride in thermoelectric applications at low temperature applications whereas Molybdenum Silicide is utilized as thermoelectric materials at high temperatures applications.
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