Comparative analysis of thermal interface materials for effective thermal management of electronic devices

Abstract

ABSTRACT Thermal interface materials (TIM) employed to electronic devices enhances interfacial heat dissipation and thermal contact conductance (TCC). This study compares the performance of TIMs (silicon grease, phase change material (PCM) and composite PCM) on a copper-aluminum contact pair under varying range of contact pressure (0.1 to 0.4 MPa) and interface temperature (35 to 65 °C). Composite PCM is prepared by mixing aluminum powder to PCM in different mass concentrations (4, 8 and 25 wt.%). Result shows that addition of aluminum powder > 8 wt.% to PCM reduces its heat storage capacity and delays heat transfer. Moreover, TCC with silicon grease outperforms PCM by 108%, while CPCM (8 wt. %) is 144% more efficient but costlier than others.