Abstract
New and advanced technologies lead to the miniaturization of electronic devices with high energy densities. Though this is commendable progress in electronic technology, cooling these systems has become arduous due to the high heat flux generation from these devices. Traditional cooling systems are lagging due to these challenges, which brings up the demand for novel cooling techniques for this purpose. This research paper focused on the comparison of cross flow and jet impingement cooling techniques used in the heat sink, the peak temperature raised and the pressure drop across the heat sink is reported. The computational Fluid Dynamics (CFD) technique is used to investigate the flow and heat transfer characteristics. Among the cases studied, it is identified that the cross-flow shows superior thermal attributes as compared to the jet impingement method, due to which the base temperatures of pin fins in the cross-flow is noticed an average of 14.5° C lower than that of jet impingement.
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