Abstract
We investigated the early stages of electroless copper (Cu) deposition onto ruthenium (Ru) using a novel ex situ electrochemical technique involving underpotentially deposited lead (Pbupd). The fractional surface coverage of Cu during electroless deposition on Ru was measured via the Pbupd deposition charge. Recognizing that the onset potential for Pbupd is surface-sensitive, the fraction of the exposed Ru substrate and that of the electroless Cu covered substrate could be quantitatively measured. Our investigation, while providing a convenient and easy-to-use surface analytical method, supports the two-dimensional electrochemical growth mode of Cu during early stages of electroless Cu nucleation on Ru.
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