Abstract
A paper by Gmelin et al examines the thermal contact resistancebetween copper surfaces above 1 K. It was concluded thatdielectric and metallic interposers significantly increasethe conductance of demountable joints. I argue that an extrapolationof electrical resistance measurements, andof thermal measurements at lower temperatures,implies that it is possible to construct considerablybetter joints without interposers. Moreover, dielectric interposerswould reduce the conductance of such joints.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
