Abstract
Mullite and cordierite are promising materials for electronic packaging due to their dielectric constant and coefficient of thermal expansion being lower than that alumina [1-5]. Recent advances in very large scale integrated circuits (VLSI) have led to materials with low dielectric constant and thermal expansion tailored over a wide range. Cordierite- dispersed-mullite composites allow a selection of materials with a wide range of values of dielectric constant and thermal expansion [6]. Mullite/ cordierite composites have been prepared by the sol-gel method using metal alkoxides [7] or by the use of composite sols [8, 9]. Such composites have aslo been prepared by solid state mixing of mullite and cordierite in the desired ratio [10].
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