Collective fabrication of microsystems compatible with CMOS through the CMP service

Abstract

One of the main obstacles to starting microsystems is the fact that particular and hence costly processes are needed. In order to reach affordable prices and a high flexibility, microsystems should whenever possible be conceived such that they can be realized on existing production lines for microelectronics, with additional post-processing for micro-system-specific 2D and 3D structures, e.g. through Multi-Project-Wafer services as proposed by the CMP service. Furthermore, this approach allows to integrate the microelectronics, needed in most microsystems, on the same chip. This paper describes the main micromachining methods, including design theory, implementation and recommendations. It presents the results obtained of microelectronics compatible fabrication methods (CMOS bulk and surface micromachining) and microelectromechanical systems that have been fabricated using these technologies. It also details the CAD tools support.