Abstract
Interest in MEMS (micro electro mechanical systems) has grown dramatically in the last decade because of a wide range of applications. These include the automotive industry, process control and automation, scientific and medical instrumentation, telecommunication, commodity products, environmental monitoring, etc. As a result, MEMS technology has become one of the most rapidly changing fields today. This paper reviews basic aspects of current MEMS technology focusing on bulk micromachining, surface micromachining, wafer bonding, and MEMS packaging, including the examples of devices made in the specific technologies. Also, some comments on future integrated MEMS are included.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.