Abstract
Intermetallic phases of binary material systems, such as TiAl, Ti3Al, RuAl, and Ni3Al have special physical properties such as a high oxidation resistance and low creep at high temperatures and a mechanical stability over wide temperature ranges. Due to new fields of application, such phases became increasingly important in the last two decades. In general, alloys can be sputtered very easily and reproducible. In surface acoustic wave (SAW) technology and microelectronics, the lift-off structuring technique is a fundamental process in the production of structured thin (<500 nm) metallic electrodes especially for low-cost fabrication of interdigital transducers (IDT). However, the structuring by standard lift-off technology only results in high quality IDTs for evaporated and not for sputtered layers. In order to investigate the intermetallic phases of the binary Ti-Al material system for IDT fabrication for SAW technology, a modified evaporator system for the simultaneous deposition of the low (Al) and the high (Ti) melting materials is presented.
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