Abstract
A new hybrid soldering and conductive adhesive joining technology using a fusible lowmelting- point alloy (LMPA) have been developed. A numerical method for numerical analysis of fusible particles behavior is proposed to investigate coalescence characteristics of fusible particles in solderable isotropic conductive adhesives (ICAs). For finding out suitable conditions to obtain reliable conduction paths, the present study examines the influence of process-related parameters such as volume fraction and viscosity on coalescence characteristics of fusible particles.
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