Abstract
Abstract This paper discusses an improved design flow for hybrid Multi-Chip Modules comprising of MMICs and other components. A full 3D electromagnetic co-simulation flow is proposed. Application of such a flow is demonstrated with an MCM receiver module which has a bulk acoustic wave pre-filter, a Low Noise Amplifier with a digital bypass function, and a classical 6th order filter implemented with discrete components. Detailed simulation data is provided on each component of the system and the final MCM module, that demonstrates the use of the design flow. Finally, simulation results are compared to measured data from fabricated modules to prove the validity of our design approach
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