CMOS sub-THz on-chip communication with SRR modulator and SPP interconnect

Abstract

Two novel metamaterial devices including Split Ring Resonator (SRR) modulator and Surface Plasmon Polariton (SPP) interconnect (including SPP T-line and coupler) are proposed with CMOS on-chip integration operated at 140GHz. By introducing sub-wavelength periodical corrugation structure onto T-line, SPP is established to propagate signals with strongly localized surface wave, which results in low crosstalk between two back-to-back placed SPP T-lines. Moreover, by stacking two SRR unit-cells with opposite placement, the SRR based modulator manifests itself as a magnetic metamaterial achieving significant reduction of radiation loss with 23dB extinction ratio at sub-THz. As explored in 65nm CMOS, the proposed surface-wave interconnects and SRR modulator have shown great potential for future sub-THz wireline communication in CMOS.