Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag., 127, pp. 147–156)

M Dube, T Kundu

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https://doi.org/10.1115/1.4000902

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Journal: Journal of Electronic Packaging	Publication Date: Nov 17, 2011
Citations: 1

Abstract

Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag., 127, pp. 147–156)

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