Abstract

The performance of high-speed wireline data links depend crucially on the quality and precision of their clocking infrastructure. For future applications, such as microprocessor systems that require terabytes/s of aggregate bandwidth, signaling system designers will have to become even more aware of detailed clock design tradeoffs in order to jointly optimize I/O power, bandwidth, reliability, silicon area and testability. The goal of this tutorial is to assist I/O circuit and system designers in developing intuitive and practical understanding of I/O clocking tradeoffs at all levels of the link hierarchy from the circuit-level implementation to system-level architecture.

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