Abstract
AbstractThe size of semiconductor dies and packaged devices continues to shrink in order to support more sophisticated and compact tablets, phones, watches and other wearables. This trend creates greater opportunities for lasers because of their unique ability to perform diverse materials processing tasks with high precision and minimal heat‐affected zone (HAZ). As a result, lasers are finding increased use in wafer dicing, package singulation, optical debonding, micro‐via drilling, RDL (re‐distribution layer) structuring, dicing tape cutting (EMI shield), soldering, annealing and laser‐assisted bonding, to name just a few. In this article, we review several laser‐based processes used in advanced packaging and examine some of the key benefits and trade‐offs in order to help guide engineers to choosing the optimum source for their particular task.
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