Chip-scale modules for high-level integration in the 21st century

Abstract

This paper describes a new level of integration and innovation required to meet the integrated circuit (IC)- and system-level challenges of the 21 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">st</sup> century. We present a technology platform in which chip-scale modules (CSMs) provide greater functionality, higher performance, lower cost, and faster time to market for many of today's emerging products. Our approach is to build CSMs that overcome formidable integration barriers without compromising individual IC technologies. By integrating various IC technologies and their supporting components, we exceed single on-chip performance. Functionality is increased through integration, and performance is improved by maintenance of an on-chip electrical environment. Applications include integrating large blocks of memory with logic, mixing analog and digital IC technologies, and integrating high-frequency ICs with high-quality (high-Q) passive components. The CSM technology platform is poised to unlock the full potential of IC technology and unleash the innovations of designers.