Abstract
With an increase in operating frequency and the complexity of system on a chip (SOC), it becomes important to consider the noise generated along the signal and power/ground interconnections that leads to malfunction. We have developed a new simulation method for the full chip-level signal and power-integrity analysis. The CAD layout data is converted into SPICE transmission line models considering silicon substrate effects. To remove the limitation of size and complexity of layout data in the real LSI chips, a sectioning method using MOR with super linear solver has been introduced. The proposed method can also be extended to the computation of current/voltage distributions leading to EMI analysis
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