Abstract
Abstract This paper contains a detailed discussion of the practical issues related to the anisotropic etching of single crystal silicon using a 5050 hydrazinewater solution. Characteristics of the etchant, etching reactor design, etch procedures, safety precautions, etch rate data for typical samples and appropriate etch-masks are among the topic discussed. The etching process is carried out in a atmospheric reflux reactor, continuously purged with nitrogen. The etch rate of (100) silicon at 115°C in this hydrazine solution is nearly 3 μm/min, which is much higher than that of ethylenediaminepyrocatecholwater (EDP) solutions. Silicon dioxide, silicon nitride and most metallic thin films, except aluminium, can be used to mask the etching process. The etch rate is reduced significantly in highly-boron-doped silicon; a boron concentration of 1.5 × 10 20 cm −3 practically stops the etch. The use of the hydrazine solution for micromachining thin silicon diaphragms, cantilevers and fibers is demonstrated.
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