Abstract
The effect of plasma treatment on the surface chemistry and morphology of Al-1%Si bond pads has been studied by a battery of analytical techniques. The ball shear strengths of the bond pads increased by ∼17% after CF4 plasma treatment. The improvement in wire bondability after plasma treatment is largely attributed to a decrease in the oxide thickness and a reduction in the height of the crystallites on the bond pad surface. However, micro-pits were formed after CF4 plasma treatment. The micro-pits become initiation sites of the first stage of a fluorine-induced corrosion where breakdown of the native passivating oxide occurs. In the second stage of corrosion, fresh Al beneath the oxide is exposed to the attack from the fluoride ions in the presence of water.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call