Abstract

Silicon carbide (SiC) is widely used in terrestrial and space applications because of its good mechanical, thermal and optical properties. Nevertheless, traditional grinding and polishing technologies cannot meet the machining requirements due to the high hardness and brittleness. In this paper, Inductively Coupled Plasma (ICP) is utilized to process the SiC optics. The effects of different processing recipes on the removal rate and temperature are investigated. The results show that the removal rate almost keeps stable with processing time and changes with the flow rate of plasma gas, reaction gas, the ratio of CF4/O2 and the power. The input power and processing time are the two main influence factors on the processing temperature.

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