Abstract

We use several characterization techniques including Raman spectroscopy, pulsed metal-oxide-semiconductor (MOS) capacitor capacitance-time, and gate oxide integrity measurements to characterize strained silicon/relaxed SiGe/graded SiGe/Si samples. The effective generation lifetime depends on the defect density in the various layers varying from 10-4 s near the surface to 10-7 s in the graded and highly defective SiGe. GOI statistical analysis shows worsening oxide breakdown as the Ge concentration in the SiGe increases.

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