Abstract
An improvement of resist pattern adhesion has been recognized as one important problem that needs to be solved in micro device fabrication. Dry film resist (DFR) patterns in circle shape are fabricated on glass substrates for the adhesion test. By applying ultrasonic vibration on a edge of DFR pattern in deionized(DI) water, the time until peeling occurred is measured. The DFR pattern can be peeled from a glass substrate under the ultrasonic vibration at 25kHz. The water intrusion model into the DFR/glass interface is employed in order to discuss the adhesion behavior.
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