Abstract
This paper reports the characterization of metal pad condition after vapor hydrofluoric (VHF) release process for microelectromechanical systems (MEMS) packaging application. There was a few different stacks of dielectric materials with metal layer been proposed as the test vehicle for the characterization analysis. The surface micrograph, roughness and bond ability of metal pad been studied in order to characterize the of metal pad condition after VHF release. The bond ability of aluminium (AlSiCu) pad after VHF released been analyzed through different metrology measurement such as Scanning electron Microscopy (SEM), Atomic Force Microscopy (AFM), Auger Spectroscopy Electron (AES), bond shear and wire pull test after wire bonding process. The analysis results were summarized and reported in this paper.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.