Characterization of High-Power COB LED Module Attached by Low-Temperature Sintered Nanosilver

Abstract

Along with the increasing demand of high power LED (>1W), multi-chip modules have made great progress to an inevitable trend. Thus, large packaging area is needed to dissipate heat efficiently. In other words, only when we find appropriate packaging materials to control the junction temperature well, can we achieve high-power LED devices in smaller packaging area. Obviously, a die-attach layer as the first-level packaging has a most significant impact on the thermal performance of a power module. So we introduce a novel die-attach material, nanosilver paste, which can be used for connecting multi-chips on the substrate because of its higher melting temperature and better thermal/electrical conductivity than conventional solders and adhesive films. What is more important, because of their ability to emit high brightness, LED packages are being exploited for other systems or fields, and in most cases are exposed to harsher environments. Therefore, the performance and stability of LED packages will be the key to assuring the reliable function of systems. So, in this paper, the optical and electrical properties of the LED device operating under various ambient temperatures from 27 to 120°C were determined. The test results showed that nanosilver paste was a very promising die-attach material in high power multi-chip modules packaging.