Abstract
In order to improve the thermal performance of the high-power LED,the novel nanosilver paste with higher melting temperature and thermal / electrical conductivity was used as die-attach material,and Al2O3-based ceramic substrates were used to form a high-power LED chip-on-board( COB) architecture. To compare the effect of die attach material,high power COB LED modules were packaged by nanosilver paste,traditional Sn / Ag3. 0 / Cu0. 5 solder and silver epoxy,respectively. The photoelectricity properties of three kinds of LEDs under various ambient temperatures from 27 to 120 ℃ were measured to evaluate their thermal management. The accelerated degradation testing under 100 ℃ was measured to evaluate the reliability. The test results show that the nanosilver paste is a very promising die-attach material for high power multi-chip modules packaging.
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