Abstract

Micro- and nanocrystalline diamond (MCD and NCD) films are deposited on 4-inch silicon substrates by a large-area multi-wafer-scale hot filament chemical vapor deposition (HFCVD) system. The films are in-situ doped by boron. The chemical and crystalline structures are studied by electron probe microanalysis (EPMA), Raman spectroscopy and X-ray diffraction (XRD). The microcrystalline films have a preferred (111) texture, while the nanocrystalline films exhibit (220) texture. Strain gauges and cantilever beam arrays are micro-fabricated by surface micro-machining techniques to characterize the residual strain and strain gradient of the diamond films. Both micro- and nanocrystalline films have small compressive strains of − 0.052% and − 0.040% respectively, with the strain gradient of about 10 − 5 μm − 1 . These values are low enough to enable the realization of many MEMS devices.

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