Abstract
TAB packaging of Fast Static RAM (FSRAM) devices is expanding rapidly. The FSRAMs are moving to manufacture on 8 wafers, so Motorola has been contemplating the expansion of the existing 6 wafer bumping fab in Chandler to create an 8 wafer bumping fab for TAB assembly for the past two years. Establishment of the 8 capability would require the investment of a very significant amount of capital. This paper addresses the use of subcontract 8 wafer bumping, services of Vendor A and Vendor B, as the strategic alternatives. This study establishes a database for the evaluation of 8 wafer bumping capability. Parallel efforts in the development of alternative inner lead bond technology has also allowed the development of a yardstick for measuring the reliability performance of the alternative TAB processes, such as bumpless, ball bumping as well as transfer bump technologies. >
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