Abstract
Application of line-focus-beam (LFB) acoustic microscopy is extended to characterization of substrates for SH-type SAW devices. Theoretical and experimental studies on a wave mode for characterization are carried out on 36/spl deg/Y-cut LiTaO/sub 3/ wafers. A Rayleigh-type mode of leaky surface acoustic waves (LSAWs) must be employed instead of an SH-type mode of leaky pseudo-surface waves (LPSAWs). Experimental results show that the LSAW propagation should be directed along the X-axis because the LSAW velocities are more sensitive to chemical composition and elastic inhomogeneities. The relations among the LSAW velocities, densities, and Curie temperatures are determined. The LSAW velocity increases linearly at the rate of 0.52 m/s//spl deg/C with the Curie temperature. A chemical composition change of 0.03 Li/sub 2/O-mol%, corresponding to temperature resolution of better than 0.3/spl deg/C, is easily detected by the velocity measurements. Elastic inhomogeneities due to residual multi-domains, produced during the poling process during wafer fabrication, are interpreted quantitatively by this ultrasonic technology. >
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