Abstract
In this research, Ni45Fe55 coatings were deposited on Si and printed circuit board (PCB) substrates using the pulse reverse plating technique. Magnetic characterization of the samples showed that the film deposited on PCB had a poor in-plane anisotropy with a coercivity of about 1.5 Oe along the hard axis. The permeability was found to be around 250 at 10 MHz which is quite low. In contrast, the coating deposited on Si showed excellent in-plane anisotropy with a much higher permeability. Microstructural and chemical composition analysis showed that both coatings were identical. However, AFM measurements showed a very significant difference in the roughness of each substrate. Consequently, it was decided to planarise the PCB surface using Benzocyclobutene (BCB). Magnetic characterization showed that after planarization, there was a well-defined easy and hard axis, the permeability increased to 700 and the coercivity dropped significantly to 0.4 Oe which were targets in this investigation.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call