Characterization and Antibacterial Potential of Melt Compounded Acrylonitrile Butadiene Styrene/Copper Nanoparticle Composites

Abstract

Copper Nanoparticle (CuNP) is mi xed as nanofiller to Acrylonitrile Butadiene Styrene (ABS) to pro duce a material that can control bacterial growth on material surfaces and improve antibacterial performance . The nanoco mposite i s produced via melt compounding using a twin-screw ext ruder. Three samples are prepared with 0%, 1.5% and 3% Copper Nanoparticle loading . Th e samples are extruded , placed in a mold and processed in a compression molding machine. The samples were characterized using Fourier Transform Infrared Spectroscopy (F TI R), X-ray Diffraction (XRD), Dynamic Mechanical Testing (DMA) and Antibacterial Testing. Results from FTIR shows presence of molecular vibrations of Acrylonitrile, Butadiene and Styrene groups with the presence of foreign substances identified as an addi ti ve used in commercial ABS production. XRD showed t he incorporation of copper nanoparticles in the nanocomposites. DMA results shows that the incorporation of copper nanoparticles into the ABS matrix results to diverse effect on its mechanical and thermal p r operty. Lastly, antibacterial test showed that both 1.5 wt% CuNP and 3 wt% CuNP exhibited high effectivity on inhibiting Escherichia coli. Index terms: Copper Nanoparticle, Acrylonitrile Butadiene Styrene, filler, nanocomposite, antibacterial material, melt compounding, twin-screw extruder, Escherichia coli .