Abstract

We have fabricated a niobium (Nb) layer for a Josephson junction by means of a high-vacuum electron beam (EB) evaporation technique. The high-vacuum EB-evaporated Nb layer is deposited under the base pressure of 4×10-9 Pa and the deposition rate of 1.2 nm/min. In spite of the extremely low deposition rate, Nb layers of over 50 nm thickness have the transition temperature of 9.3 K and the ratio of residual resistivity of more than 3. The surface roughness and the grain size of the high-vacuum EB-evaporated Nb layer are studied using atomic force microscopy and X-ray diffraction analysis. The stress in the high-vacuum EB-evaporated Nb layers is examined by measuring the change in the radius of curvature of the substrate before and after Nb layer deposition, and the X-ray diffraction patterns of the Nb layers. The high-vacuum EB-evaporated Nb layer exhibits a weak tensile stress.

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