Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging

Abstract

This study investigated the effect of the viscosity of the ECAs using a low-melting-point alloy (LMPA) filler on its bonding characteristics. The curing behaviors of the ECAs were determined using Differential Scanning Calorimetry (DSC), and ECA temperature-dependant viscosity characteristics were observed using a torsional parallel rheometer. The wetting test was conducted to investigate the reduction capability of ECAs and the flow-coalescence-wetting behavior of the LMPAs in ECAs. Electrical and mechanical properties were determined and compared to those with commercial ECAs and eutectic tin/lead (Sn/Pb) solder. In the metallurgically interconnected Quad Flat Package (QFP) joint, a typical scallop-type Cu–Sn intermetallic compound (IMC) layer formed at the upper SnBi/Cu interface after curing process. On the other hand, a (Cu, Ni)6Sn5 IMC layer formed on the SnBi/ENIG interface. In addition, the fracture surface exhibited by cleavage fracture mode and the fracture was propagated along the Cu–Sn IMC/SnBi interface. The extremely low-level viscosity of ECAs had a significant influence on the flow-coalescence-wetting behavior of the LMPAs in ECAs and also on the interconnection properties. Stable interconnected assemblies showed good electrical and mechanical properties.