Abstract
Bi 2O 3–ZnO–SiO 2–B 2O 3–Al 2O 3–CaO glass frits with glass transition temperature of 442 °C are prepared by spray pyrolysis. The mean size of the glass frits prepared at 1400 °C is 0.87 μm. The grain size of the silver conducting film formed from the Ag paste increases with increasing addition amount of glass frit. The glass frit improves the adhesion strength of the silver conducting film to the Si wafer substrate. Glass material is well distributed inside the grains of the silver conducting films fired at 600 °C, in which segregation of the glass material did not occur. Segregation of glass material in grain boundaries of the silver conducting films increases with increasing firing temperatures. The specific resistances of the silver conducting films with 3 and 5 wt.% glass material of silver component are 2.6 and 2.8 μΩ cm at a firing temperature of 700 °C.
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