Abstract
An investigation was undertaken to explore the grinding characteristics in grinding of yttrium vanadata (YVO4) crystal by using a resin diamond wheel. The grinding forces and surface roughness were measured and the morphological features of ground workpiece surfaces were examined. The results indicate that the depth of cut is the leading factor in affecting grinding forces whereas the surface roughness is mainly governed by the grinding speed. The material removal mechanism was found to be dominated by brittle fracture mode at conventional grinding speeds, and gradually transfer to ductile flow mode under higher grinding speeds, which is greatly related to the maximum undeformed chip thickness.
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