Abstract
The gap between component-level and system-level Electrostatic Discharge (ESD) tests is an ongoing problem for microelectronics. Without powering the Device Under Test (DUT) during component-level tests, there is no way to identify soft- failures of a component during operation of the final system, before the first prototype is available. In this work, detection of the component-level soft-failures by monitoring the response of the DUT while stressing with Transmission Line Pulse (TLP) is discussed on the example of an LM741C operational amplifier. Parameters used for soft-failure detection are included in the quasi-static Current over Voltage Characteristic. Additionally, a Wunsch-Bell-like characteristic for TLP induced soft-failure is presented. With these new characteristics, Integrated Circuit (IC) designers can provide system designers with valuable information on DUT soft-failure susceptibility and its response to TLP, without revealing any sensitive technology information.
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