Chapter 7.2 - 7.2 Lapping and Polishing Technology

Abstract

This chapter discusses the lapping and polishing technology. Lapping, polishing, and low-speed grinding occur by the sliding frictions between abrasives and work surface. This processing can be applied to all solid materials for fabricating many kinds of devices, for instance, from the soft Japanese lacquer-painted surface of organic substances to hard materials such as advanced ceramics and diamonds. The main difference between lapping, polishing, and low-speed grinding is obvious in glass lens and prism manufacturing. The chapter describes the principle of rough processing and mirror-like processing for hard and brittle materials, including ceramics. The process of mechanochemical polishing of silicon wafers has been active for upgrading various polishing methods, and the classification and analysis of material-removing mechanisms and methods have become the starting point for the proposed new ultraprecision polishing. In glass polishing and mechanochemical polishing of silicon wafers, work surfaces are covered with a soft film by chemical reactions.