Abstract
Chemical vapor deposition (CVD) is a technology used for forming solid powders in the gas phase or depositing films on substrates from precursors in the gas phase. Many precursors are liquids or solids under ordinary conditions, and they are first vaporized for use in CVD. Based on the process mainly being physical or chemical, vapor deposition has been divided into two kinds, namely physical vapor deposition (PVD) and chemical vapor deposition. Vacuum vaporization, spattering, ion plating, etc. usually belong to PVD; and vapor depositions based on chemical reactions or plasma-enhanced chemical reactions are called CVD or plasma-enhanced chemical vapor deposition (PECVD or PCVD). Due to the development of science and technology, there are some cases that crossly belong to both parts, such as reaction spattering and reaction ion plating, in which metals are vaporized by spattering or ion bombardment and reacted to produce oxides or nitrides that combine both physical and chemical processes. With the progress of human beings, the technology of chemical vapor deposition had also been developed consciously.
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