Abstract
In this chapter, an overview of electromigration, which is an electric current driven diffusion controlled phenomenon, in solid pure metals, alloys, and liquid metals will be presented, along with the description of fundamental quantitative expressions. Effects of thermomigration–electromigration coupling and electromigration-induced back-stress in solid metal lines on the resultant mass transport will also be discussed. Since electromigration is a diffusion-controlled phenomenon that generates a stress gradient in a conductor, it may affect several stress directed diffusion controlled phenomena, such as whiskering, creep, etc. In this context, a brief introduction of whisker growth, especially in Sn coatings, will be presented. Finally, a correlation between electromigration and whiskering will be explored by using the link between the electromigration driven mass transport, back-stress, and the whiskering mediated relaxation of the generated stress.
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