Chapter 13 - Packaging Technologies for Optical Components: Integrated Module

Abstract

This chapter presents the state-of-the-art technologies, as required for integrated optical module. Hybrid integration techniques allow achieving of the high functional optical module, eliminating the technology barrier required in monolithic integration. The demands for high-speed data transmission and the needs for an integrated optical module comprising more functional optical devices, and electronics devices, are increasing. The reasons for this need are to improve the total module performance, and to make packaging doing integration cost effective. The chapter discusses the technology requirements and technologies for wiring. It further discusses two packages: low-cost packages for single functional device and packaging for multi-functional devices. Future road map/trends in the optical packaging area are also included in the chapter. Future developments for the optical module will see further miniaturization, and incorporation of both electrical and optical functional devices inside the single package, reducing the space requirements to cut the system complexities, high volume manufacturability, and yet lower cost.