Abstract
Over the years focused ion-beam (FIB) systems have evolved into high-performance commercial tools for direct writing microfabrication. The FIB systems combine precise material modification at the nanometer scale utilizing removal, deposition, and implantation with in situ imaging capabilities for navigation, alignment, and inspection. The widely used systems are low-energy 25-50 keV ionbeam tools for surface micromachining applications utilizing sputtering and ion-beam-induced surface reactions. The low-energy focused ion-beam systems are established tools in the semiconductor industry and are successfully used for applications such as failure analysis, prototype-device modification, and lithographic mask repair. This chapter focuses on the main components and principle of operation of a FIB system. It discusses ion solid interactions layingemphasis on the main effects important for micromachining applications such as image generation, sputtering, and ion-induced surface reactions. The chapter reviews applications of focused ion-beam direct writing as well.
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