Abstract
Electrochemical deposition processes have become increasingly accepted in mainstream semiconductor and microelectronic processing over the last four decades. The most commonly discussed process is copper deposition for damascene interconnect manufacturing, but plating has also been used extensively for depositing metal layers in thin film recording heads, depositing solder alloys for flip chip bumps and for depositing gold conductors in III-V semiconductor devices. There are many other opportunities to utilize electrochemical processes in microelectronic manufacturing. This overview discusses some of the current development direction of processes currently in use, as well as some opportunities for implementing additional electrochemical processes in semiconductor processing.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
