Modeling Electrode Shape Changes in Electrodeposition and Electrochemical Dissolution

Abstract

In the fields of metal production, surface finishing, and electronic device manufacturing, achieving precise control over electrochemical processes is crucial for product quality, efficiency, and cost-effectiveness. This paper introduces an open-source modeling tool based on a dynamic mesh technique built on the finite volume method using the C ++ toolbox OpenFOAM. This tool has been validated against both newly proposed analytical solutions and existing numerical and experimental results in various conditions and kinetic controls. The analytical solution predicts the electrode surface position, current, or cell voltage difference for confined electrodes. It considers primary and secondary current distributions with linear kinetics under different electric control modes. Notably, the validation highlights the congruence of the new method with prior studies and underscores its potential to offer enhanced predictive capabilities. Furthermore, this work extends beyond traditional modeling approaches by incorporating pulse reverse plating, which has been successfully modeled using the dynamic mesh method. Additionally, a modified Wagner number (WaPR) is proposed to predict in advance the optimal conditions for achieving a more uniform deposit. This innovative approach contributes to the advancement of theoretical understanding and will improve practical applications in electrochemical deposition and dissolution processes.