Abstract
In high speed digital board such as Printed Circuit Board, discontinuity between a transmitter and a receiver is caused by the interconnecting path, transmission lines and via transitions. Hence, to avoid signal reflections and provide best system performance at high transmission rates, the connecting path's impedance must be as uniform as feasible. The impedance of transmission lines is relatively easy to adjust, whereas the impedance of vias is significantly more difficult to adjust. This paper focuses on techniques to provide signal integrity incorporating techniques. The different parameters affecting the signals are analysed using five cases. Maintaining the signal impedance uniformly by varying capacitive and inductive effects throughout the board provides better assessments.
Published Version
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