Abstract

The structure design of abrasive particles provides an available approach for improving both surface roughness and polishing efficiency in chemical–mechanical planarization/polishing (CMP) applications. In this work, the hexagonal mesoporous silica (H-mSiO2) particles with parallel channels were prepared via a modified tyltrimethylammonium bromide-assisted template method. And the ceria nanoparticles attached to H-mSiO2 was achieved by a solution synthesis technique. The core–shell structure of the as-prepared H-mSiO2–CeO2 composites was characterized in terms of X-ray diffraction, field emission scanning electron microscope, high-resolution transmission electron microscope, nitrogen adsorption/desorption measurement, and STEM–EDX mapping techniques. The oxide–CMP performance of the H-mSiO2–CeO2 composite particles as abrasives was evaluated in terms of surface finish and material removal rate. For comparison, the commercial ceria abrasives and solid silica (sSiO2)–CeO2 composite particles with non-porous sSiO2 cores were also tested under the same CMP conditions. Oxide–CMP results revealed that the H-mSiO2–CeO2 composite abrasives contributed to the finish reduction, efficiency improvement, and scratch elimination with respect to conventional ceria abrasives. By comparing with rigid solid silica (sSiO2)–CeO2 particles, the non-rigid H-mSiO2–CeO2 composites revealed a reduced surface roughness (0.17 nm vs. 0.33 nm, root-mean-square values), a low topographical variation (± 0.4 nm vs. ± 0.8 nm), and an improved removal rate (203 nm/min vs. 144 nm/min). The improved CMP performance might be attributed to the enhanced overall elastic response and reduced particle density, resulting from their hexagonal meso-silica cores with abundant parallel channels. Moreover, the increased Ce3+ concentration also contributed the improvement of polishing efficiency. This work describes an effort to explore the relationship between the meso-silica structure and finishing performance of the ceria-based core–shell abrasives for optimizing oxide–CMP characteristics.

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