Abstract
Summary High-power-density electronics used in modern cellular devices and radiofrequency electronics generate tremendous localized thermal energy (up to 300 W/cm2), posing serious concerns regarding performance, life cycle, and safety. Further increasing the power density of these communications electronics requires effective methods to conduct generated heat away from critical components. In this work, a magneto-vibrational mold-casting technique is used to produce aligned and percolated thermal pathways through hexagonal boron nitride particles for effective steady-state passive cooling from high-density electronics. Additionally, 3D magnetic printing is used to produce custom thermal pathways. Thermal interface material testing (ASTM D5470) is utilized to determine system-level through-thickness thermal conductivity (K⊥, including interfacial resistances) of up to 9 W/m-K, a >3-fold increase versus unaligned controls. These described new manufacturing approaches produce a unique class of castable and printable dielectric composites with high thermal conductivity.
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