Abstract
A thermal imaging camera suitable for use on micron-sized active semiconductor devices has been developed. Based on a visible light thermoreflectance technique, this camera achieves 50mK temperature sensitivity and sub-micron spatial resolution when imaging the top metal contact layer. By using a photodiode array, sensitivity is improved over what is possible with a CCD (Charge Coupled Device) based system. Thermal imaging results of an ultra small 10 micron diameter SiGe micro-cooler is also presented.
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